发明名称 |
PACKAGE STRUCTURES HAVING INTEGRATED WAVEGUIDES FOR HIGH SPEED COMMUNICATIONS BETWEEN PACKAGE COMPONENTS |
摘要 |
Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier. |
申请公布号 |
US2016276727(A1) |
申请公布日期 |
2016.09.22 |
申请号 |
US201514662610 |
申请日期 |
2015.03.19 |
申请人 |
International Business Machines Corporation |
发明人 |
Dang Bing;Liu Duixian;Plouchart Jean-Olivier;Valdes-Garcia Alberto |
分类号 |
H01P5/107;H01P3/16 |
主分类号 |
H01P5/107 |
代理机构 |
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代理人 |
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主权项 |
1. A package structure, comprising:
a package substrate comprising an integrated waveguide; and a first integrated circuit chip and a second integrated circuit chip mounted to the package substrate; wherein the first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition; wherein the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition; and wherein the first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide of the package substrate. |
地址 |
Armonk NY US |