METHODS FOR THICK FILM THERMOELECTRIC DEVICE FABRICATION

摘要

Solid state thermoelectric energy conversion devices can provide electrical energy from heat flow, creating energy, or inversely, provide cooling through applying energy. Thick film methods are applied to fabricate thermoelectric device structures using microstructures formed through deposition and subsequent thermal processing conditions. An advantageous coincidence of material properties makes possible a wide variety of unique microstructures that are easily applied for the fabrication of device structures in general. As an example, a direct bond process is applied to fabricate thermoelectric semiconductor thick films on substrates by printing and subsequent thermal processing to form unique microstructures which can be densified. Bismuth and antimony telluride are directly bonded to flexible nickel substrates.

主权项

1. A process for producing a thick film precursor composition with a free volume microstructure, the process comprising the steps of:
(a) forming a powder comprising of one or more elements, alloys, or compounds; (b) combining the powder with a vehicle and a thinning agent to form a paste; (c) depositing the paste to form a layer on a surface; (d) drying the layer to remove the thinning agent; and (e) at least partially sintering the layer, wherein most of the vehicle is volatized leaving the free volume within the layer, and wherein the powder becomes an interconnected microstructure with the free-volume within the layer.