DOUBLE SIDE MOUNTING MEMORY INTEGRATION IN THIN LOW WARPAGE FANOUT PACKAGE

摘要

Packages and methods of formation are described. In an embodiment, a package includes a redistribution layer (RDL) formed directly on a top die, and a bottom die mounted on a back surface of the RDL.

主权项

1. A package comprising:
a redistribution layer (RDL); a first die bonded to a front side of the RDL, wherein a first redistribution line of the RDL is formed on a first contact pad of the first die; a first molding compound encapsulating the first die on the front side of the RDL; a second die mounted on a back side of the RDL; a plurality of conductive pillars extending from the back side of the RDL; and a second molding compound encapsulating the second die and the plurality of conductive pillars on the back side of the RDL.