LIQUID COOLED COMPLIANT HEAT SINK AND RELATED METHOD

摘要

A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.

主权项

1. A heat sink for cooling an integrated circuit (IC) chip, the heat sink comprising:
a liquid-filled cooling system including a variable volume liquid-filled chamber and a microjet device introducing fluid into the variable volume liquid-filled chamber; and a thermally conductive, compliant foil backed by a liquid in the variable volume liquid-filled chamber, wherein a pressure of the liquid on the compliant foil provides a uniform pressure by the foil against the IC chip and causes the compliant foil to conform to a surface of the IC chip.