Electronic devices with encapsulating silicone based adhesive

摘要

A flexible electronic device is provided that includes electronics, metal traces, and other components at least partially encapsulated in a protective, corrosion- and fluid-resistant encapsulating adhesive coating. The device include electronics, sensors, and other components disposed on a flexible substrate that is configured to be mounted to a body or disposed in some other environment of interest. The encapsulating adhesive coating is flexible and adheres securely to the electronics, metal traces, and other components disposed on the flexible substrate. The encapsulating adhesive coating prevents voids from forming proximate the components within which water or other chemicals could be deposited from the environment of the device. The encapsulating adhesive coating could include silicone or other flexible highly adhesive substances. The encapsulating adhesive coating could be a conformal coating.

主权项

1. A method comprising:
forming traces in a layer of metal, wherein the layer of metal is disposed on an adhesive layer, wherein the adhesive layer is disposed on a flexible substrate, and wherein forming the traces comprises patterning the layer of metal to provide electrical connections between one or more electronic components; disposing one or more electronic components on the traces, wherein disposing the one or more electronic components on the traces comprises electrically connecting the one or more electronic components to the traces; and forming an encapsulating sealant layer, wherein forming an encapsulating sealant layer comprises forming a sealant layer that is configured to adhere to the adhesive layer and to at least partially encapsulate the traces and the one or more electronic components.