发明名称 |
LEAD FRAME WITH CONDUCTIVE CLIP FOR MOUNTING A SEMICONDUCTOR DIE WITH REDUCED CLIP SHIFTING |
摘要 |
A semiconductor assembly includes a semiconductor die comprising lower and upper electrical contacts. A lead frame having a lower die pad is electrically and mechanically connected to the lower electrical contact of the die. An upper conductive member has a first portion electrically and mechanically connected to the upper electrical contact of the die. A lead terminal has a surface portion electrically and mechanically connected to a second portion of the conductive member. The surface portion of the lead terminal and/or the second portion of the conductive member has a series of grooves disposed therein. Packaging material encapsulates the semiconductor die, at least a portion of the lead frame, at least a portion of the upper conducive member and at least a portion of the lead terminal. |
申请公布号 |
WO2016200534(A1) |
申请公布日期 |
2016.12.15 |
申请号 |
WO2016US31761 |
申请日期 |
2016.05.11 |
申请人 |
VISHAY GENERAL SEMICONDUCTOR LLC |
发明人 |
DING, Hui-Ying;WANG, Pengnian;YU, Tao;LIU, Jun-Feng;BAI, Jun-Kai;PENG, Chih-Ping |
分类号 |
H01L23/495;H01L23/31;H01L23/433;H01L23/64;H01L33/48 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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