发明名称 Heat-dissipating device and method for manufacturing a housing of the heat-dissipating device
摘要 A heat-dissipating device and a method for manufacturing a housing of the heat-dissipating device have been proposed. A metal plate is stamped to form a blank plate having a central area with a first set of fins, a second set of fins, and a number of assembly holes. The blank plate is further pressed to make the first set of fins and the second set of fins extend upright relative to the central area and surround the central area. The assembly holes allow the housing to be engaged by fasteners to a mounting plate with a fan.
申请公布号 US2001037571(A1) 申请公布日期 2001.11.08
申请号 US20000499738 申请日期 2000.02.08
申请人 HORNG ALEX 发明人 HORNG ALEX
分类号 B21D53/04;H01L21/48;H01L23/367;H01L23/467;(IPC1-7):B21D53/02 主分类号 B21D53/04
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