发明名称 |
Method and apparatus for fluid processing a workpiece |
摘要 |
A method and apparatus for fluid processing a workpiece are described. The system can include a process module and a system of one or more fluid processing elements to control the fluid flow and/or the electric field distribution during the fluid processing of the workpiece. A member can be used to agitate the fluid during deposition of a film (e.g., using an oscillatory motion). A plate can be used to shape an electric field incident on a surface of a workpiece. By controlling the fluid flow and the electric field distribution, improved deposition of the film on the workpiece surface can result. Furthermore, a vertical configuration and/or a modular architecture can be employed to improve throughput, increase productivity, and reduce cost.
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申请公布号 |
US2005167275(A1) |
申请公布日期 |
2005.08.04 |
申请号 |
US20040971726 |
申请日期 |
2004.10.22 |
申请人 |
KEIGLER ARTHUR;HARRELL JOHN;LIU ZHENQIU;WU QUNWEI |
发明人 |
KEIGLER ARTHUR;HARRELL JOHN;LIU ZHENQIU;WU QUNWEI |
分类号 |
B23K15/00;C25D5/18;C25D5/22;C25D7/12;C25D17/00;C25D21/10;C25D21/12;H01L21/00;(IPC1-7):C25D5/18 |
主分类号 |
B23K15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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