| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device that has high yields and can be manufactured inexpensively by packaging a spacer on a body to be packaged three-dimensionally by a method similar to a conventional method using an adhesive sheet for the spacer, to provide the adhesive sheet for spacers used in the manufacturing method, and to provide the semiconductor device obtained by the method. <P>SOLUTION: The manufacturing method of a semiconductor device using the adhesive sheet for spacers comprises: a process for preparing the adhesive sheet for spacers having a spacer layer with an adhesive layer at least on one surface, dicing the adhesive sheet for spacers, and forming a chip-like spacer having the adhesive layer; and a process for fixing the spacer to the body to be deposited via the adhesive layer. <P>COPYRIGHT: (C)2007,JPO&INPIT |
