| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin sealing method of electronic parts capable of preventing a deformation and/or a disconnection of a bonding wire caused by a flow of sealing resin from occurring, further preventing the bonding wire from short-circuiting with a next-door bonding wire. <P>SOLUTION: The resin sealing method of the electronic parts comprises the steps of: fixing a substrate 21 equipped with electronic parts 22 to an upper metallic mold 15; arranging a resin material 37 at a cavity section 10 formed in a lower metallic mold 7 by resin material injection equipment 30, and heating and melting the resin material 37 to make molten resin; and immersing the electronic parts 22, into the molten resin to make a resin seal of the electronic parts 22, by closing the upper metallic mold 15 and the lower metallic mold 7. In the resin material injection equipment 30, the resin material 37 is arranged at a resin material accommodation 33 having almost the same size as that of the cavity 10 of the lower metallic mold 7. The resin material 37 is accommodated in the cavity 10 of the lower metallic mold 7, by uniformly pressurizing the resin material 37 in the resin material accommodation 33 by pressurization means 31, and by almost uniformly dispersing the resin material 37 in the resin material 35 accommodation 33 by oscillating means, and by opening the resin material accommodation 33. <P>COPYRIGHT: (C)2007,JPO&INPIT |
