EPOXY RESIN COMPOSITION, PREPREG, LAMINATED BOARD AND PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for a metal-clad laminate, capable of decreasing the thermal expansion coefficient of an insulation layer in plane direction and thickness direction and keeping the peeling strength of a copper foil. SOLUTION: The epoxy resin composition contains an epoxy resin as a main component and a curing agent, and further contains (A) core-shell structure rubber particles having a core comprising a rubber elastomer particle incompatible with the epoxy resin and a shell layer compatible with the epoxy resin and covering the core and (B) an inorganic filler. The amount of the core-shell structure rubber particle is 5-20 pts.mass based on 100 pts.mass of the solid resin component except for the core-shell structure rubber particle. The amount of the inorganic filler comprising an acicular or plate-form insulation material having a Mohs hardness of≤5 is 30-70 pts.mass based on 100 pts.mass of the solid resin component except for the core-shell structure rubber particle. COPYRIGHT: (C)2008,JPO&INPIT