Solution, Component for Plating, Insulating Sheet, Laminate, and Printed Circuit Board

摘要

It is an object of the present invention to provide a component for plating suitably used in, for example, producing a printed circuit board, a solution, and a printed circuit board including the component, the component for plating having satisfactory adhesion to an electroless plating film provided on a surface of the component even when the surface roughness of the surface of the component is small. The object is achieved by a component for electroless plating including at least a surface a for electroless plating, the surface a having a surface roughness of 0.5 mum or less in terms of arithmetic average roughness measured with a cutoff value of 0.002 mm, and the surface a containing a polyimide resin having a siloxane structure.