| 摘要 |
PROBLEM TO BE SOLVED: To provide the mounting structure of a small semiconductor element, which can comparatively easily pattern a circuit conductor. SOLUTION: This mounting structure is formed of an insulating substrate 1, where circuit patterns 2 are bonded on an upper face and a large number of connection pads 3 on the partial upper faces of the circuit patterns 2 and of a square semiconductor element 2 having a large number of terminals 5 at a lower face. The terminals 5 of the semiconductor element 4 are connected to the connection pads 3 on the insulating substrate 1 via conductive adhesive 6. The large number of connection pads 3 are arranged along one side of the semiconductor element 4 in a zigzag form. Width W1 in a direction orthogonal to the deriving direction of the connection pads 3 is made gradually wider as it distance itself from one side and length W2 to be gradually narrower as it distance itself from one side. Conductive adhesive 6 is coated by a sealing material 7 formed of bisphenol base epoxy resin. |
