发明名称 ウェーハ面取り装置、および面取り用砥石の表面状態または面取り用砥石によるウェーハの加工状態の検出方法
摘要 PROBLEM TO BE SOLVED: To realize a wafer chamfering device capable of inducing a detection signal of an AE sensor provided on a rotation grindstone side to a stationary side in a non-contact manner, and determining a contact state or a surface state of a grindstone by signal processing of the induced signal.SOLUTION: A wafer chamfering device has: a wafer table 10 holding and rotating a wafer W; and a grindstone rotary mechanism holding and rotating a chamfering grindstone 20. The grindstone rotary mechanism has a rotary unit and a stationary unit. The rotary unit has an AE sensor 34 and transmission means 31. The stationary unit has reception means 41 communicating with the transmission means, and a signal processing circuit 65. The transmission means detects a signal of the AE sensor. The signal processing circuit has an amplifier 63, an AD converter 64, and a digital processing circuit, performs filtering processing for removing a low-frequency component, and further performs processing for extracting signal change corresponding to a rotation cycle of the rotary unit.
申请公布号 JP5943578(B2) 申请公布日期 2016.07.05
申请号 JP20110223970 申请日期 2011.10.11
申请人 株式会社東京精密 发明人 野村 佳宏
分类号 H01L21/304;B24B9/00;B24B49/10 主分类号 H01L21/304
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