Polishing apparatus and polishing method

摘要

A polishing apparatus includes: a rotatable polishing table for supporting a polishing pad having a polishing surface; a top ring head having a top ring; a top ring head cover surrounding the top ring head; a dresser head having a dresser configured to dress the polishing surface; a dresser head cover surrounding the dresser head; a spray nozzle configured to spray a cleaning liquid onto an upper surface of the top ring and an outer surface of the top ring head cover when the top ring is in the substrate transfer position; and a spray nozzle configured to spray a cleaning liquid onto an outer surface of the dresser head cover when the dresser is in the retreated position.

主权项

1. A polishing apparatus comprising:
a rotatable polishing table for supporting a polishing pad having a polishing surface; an atomizer head configured to spray a cleaning fluid onto the polishing surface to clean the polishing surface; and an atomizer cover that covers an upper surface of the atomizer head, the atomizer cover including
a semicylindrical top plate having a semicylindrical shape, anda first side plate and a second side plate extending downward from both lower ends of the semicylindrical top plate, the semicylindrical top plate including
a first top plate having a vertical cross section in a shape of an arc whose radius is constant over its entire length from a base end to a distal end of the atomizer cover, anda second top plate having a vertical cross section in a shape of an arc whose radius decreases gradually from the base end toward the distal end of the atomizer cover, the first top plate and the second top plate being connected to each other at their top portions to constitute the semicylindrical top plate.