Polishing composition and polishing method using the same

摘要

The present invention provides a polishing composition that can be suitably used in polishing of polysilicon, and a polishing method using the polishing composition. The polishing composition contains a nitrogen-containing nonionic surfactant and abrasive grains and has a pH of 9 to 12. The content of the nitrogen-containing nonionic surfactant in the polishing composition is preferably 20 to 500 ppm. The abrasive grains contained in the polishing composition are preferably colloidal silica. The average primary particle diameter of the abrasive grains contained in the polishing composition is preferably 10 to 90 nm. The content of the abrasive grains in the polishing composition is preferably 1.0 to 5.0% by mass.

主权项

1. A method of polishing polysilicon, comprising:
preparing a polishing composition containing colloidal silica abrasive grains and a nitrogen-containing nonionic surfactant selected from the group consisting of a polyoxyethylene alkyl amino ether and a polyoxyethylene fatty acid amide, wherein the nitrogen-containing nonionic surfactant is contained in the polishing composition in an amount of 20 to 85 ppm, and wherein the polishing composition has a pH of greater than 9 to 12; and using the polishing composition to polish polysilicon.