发明名称 |
Substrate lamination method |
摘要 |
A method for laminating substrates may include disposing a pressure-sensitive adhesive layer (103) between a substantially planar surface of a first substrate (101) and a substantially planar surface of a second substrate (102), disposing the first substrate, the pressure-sensitive adhesive layer, and the second substrate within a vacuum chamber (110), evacuating the vacuum chamber, and applying a pressure to at least one of the first substrate and the second substrate. |
申请公布号 |
EP2749412(B1) |
申请公布日期 |
2016.09.14 |
申请号 |
EP20140161363 |
申请日期 |
2009.01.15 |
申请人 |
ROCKWELL COLLINS, INC. |
发明人 |
BARNIDGE, TRACY J.;NEMETH, PAUL R.;SAMPICA, JAMES D.;MARZEN, VINCENT P. |
分类号 |
B32B37/26;B32B37/10;H01L51/52 |
主分类号 |
B32B37/26 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|