| 摘要 |
A tape with a chip-bonding area is provided. The tape is suitable for a chip on film configuration, wherein a chip is suitable for being disposed on the tape and in the chip-bonding area. The tape includes a dielectric base film, a first wiring pattern, and at least a second wiring pattern. The first wiring pattern is disposed on the dielectric base film and has multiple inner leads disposed in the chip-bonding area. The second wiring pattern is disposed on the dielectric base film and in the chip-bonding area. The chip is suitable for being electrically connected to at least a part of the inner leads and being disposed above the second wiring pattern.
|
