Copper alloys for chip interconnections and method of making
摘要
Copper alloys containing between 0.01 and 10 weight percent of at least one alloying element selected from carbon, indium and tin for improved electromigration resistance, low resistivity and good corrosion resistance that can be used in chip and package interconnections and a method of making such interconnections and conductors by first forming the copper alloy and then annealing it to cause the diffusion of the alloying element toward the grain boundaries between the grains in the alloy are disclosed. <IMAGE>
申请公布号
EP0751567(B1)
申请公布日期
2007.11.28
申请号
EP19960109355
申请日期
1996.06.12
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
ANDRICACOS, PANAYOTIS C.;DELIGIANNI, HARIKLIA;HARPER, JAMES MCKELL EDWIN;HU, CHAO-KUN;PEARSON, DALE JONATHAN;REYNOLDS, SCOTT KEVIN;TU, KING-NING;UZOH, CYPRIAN EMEKA