SEMICONDUCTOR DEVICE

摘要

Provided is a semiconductor device which has reduced sizes, lower manufacturing cost by simplifying the manufacturing process and a cavity. A device element (3) is formed on the front surface of a semiconductor substrate (4), and a sealing body (1) is bonded on the semiconductor substrate (4) through a bonding layer (6).The main surface (rear surface) of the sealing body (1) facing the semiconductor substrate (4) is bent inward, and a fixed space (cavity (2)) is arranged between the sealing body (1) and the semiconductor substrate (4). Since the rear surface of the sealing body (1) is bent, the sealing body (1) can be used not only as a sealing member for the device element (3) but also as a plano-concave lens (opposite direction).