发明名称 |
Manufacturing Method of Electronic Component |
摘要 |
A method of manufacturing an electronic component minimizes the occurrence of voids and degradation of characteristics in a resin-sealed portion, while reducing the costs thereof. A sealing step for sealing surface acoustic wave elements by a sealing resin member formed from a resin film is performed by mounting the surface acoustic wave elements on a collective mounting substrate and the resin film in a bag with a gas-barrier property, and causing the resin film to infiltrate between the surface acoustic wave elements mounted on the reduce-pressured-packed collective mounting substrate to be hermetically sealed by the pressure difference between the inside and the outside of the bag.
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申请公布号 |
US2008313895(A1) |
申请公布日期 |
2008.12.25 |
申请号 |
US20040595988 |
申请日期 |
2004.12.07 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
HIGUCHI MASATO;SHINKAI HIDEKI;ISHIKAWA OSAMU |
分类号 |
H05K3/30;H01L21/56;H03H3/08;H03H9/10 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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