发明名称 Line width protector printed circuit board and method of manufacturing the same
摘要 A printed circuit board includes an insulating layer; and a circuit pattern formed on the insulating layer. The circuit pattern includes a seed layer and a metal layer formed on the seed layer, and both sides of the seed layer are formed with an etched groove. Also, a method of manufacturing a printed circuit board includes: forming a seed layer on the insulating layer; forming a plating resist formed with an opening on the seed layer; forming a circuit pattern by performing plating processing on the opening; removing the plating resist; forming a passivation layer on the circuit pattern; performing dry etching on a remaining portion other than a side wall of the passivation layer; and performing wet etching the seed layer exposed on a surface by the dry etching.
申请公布号 US9386706(B2) 申请公布日期 2016.07.05
申请号 US201314140803 申请日期 2013.12.26
申请人 Samsung Electro-Mechanics Co., Ltd. 发明人 Han Sung;Kweon Young Do;Baek Seung Min;Kim Yoon Su;Lee Young Jae
分类号 H05K3/10 主分类号 H05K3/10
代理机构 NSIP Law 代理人 NSIP Law
主权项 1. A printed circuit board, comprising: an insulating layer; and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a seed layer and a metal layer formed on the seed layer, and both sides of the seed layer are formed with an etched groove.
地址 Suwon-si KR