发明名称 |
Line width protector printed circuit board and method of manufacturing the same |
摘要 |
A printed circuit board includes an insulating layer; and a circuit pattern formed on the insulating layer. The circuit pattern includes a seed layer and a metal layer formed on the seed layer, and both sides of the seed layer are formed with an etched groove. Also, a method of manufacturing a printed circuit board includes: forming a seed layer on the insulating layer; forming a plating resist formed with an opening on the seed layer; forming a circuit pattern by performing plating processing on the opening; removing the plating resist; forming a passivation layer on the circuit pattern; performing dry etching on a remaining portion other than a side wall of the passivation layer; and performing wet etching the seed layer exposed on a surface by the dry etching. |
申请公布号 |
US9386706(B2) |
申请公布日期 |
2016.07.05 |
申请号 |
US201314140803 |
申请日期 |
2013.12.26 |
申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
Han Sung;Kweon Young Do;Baek Seung Min;Kim Yoon Su;Lee Young Jae |
分类号 |
H05K3/10 |
主分类号 |
H05K3/10 |
代理机构 |
NSIP Law |
代理人 |
NSIP Law |
主权项 |
1. A printed circuit board, comprising:
an insulating layer; and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a seed layer and a metal layer formed on the seed layer, and both sides of the seed layer are formed with an etched groove. |
地址 |
Suwon-si KR |