CURABLE COMPOSITION FOR PRINTED WIRING BOARD, AND CURED COATING AND PRINTED WIRING BOARD USING SAME

摘要

Provided is a curable composition for a printed wiring board, which composition exhibits high physical strength as a coating film in terms of solder heat resistance, pencil hardness and the like and in which the components contained therein are not likely to precipitate in long-term storage even when the composition is configured to have a low viscosity and thereby made applicable to ink-jet printing, spin-coating and the like. The curable composition for a printed wiring board is characterized by comprising (A) a filler having a specific gravity of 3 or less, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator. The (A) filler having a specific gravity of 3 or less is preferably an inorganic filler.

主权项

1. A curable composition for a printed wiring board, said curable composition comprising:
(A) a filler having a specific gravity of 3 or less; (B) a hydroxyl group-containing (meth)acrylate compound; and (C) a photopolymerization initiator.