发明名称 SILICON NITRIDE SUBSTRATE AND SILICON NITRIDE CIRCUIT BOARD USING THE SAME
摘要 A silicon nitride substrate including silicon nitride crystal grains and a grain boundary phase and having a thermal conductivity of 50 W/m·K or more, wherein, in a sectional structure of the silicon nitride substrate, a ratio (T2/T1) of a total length T2 of the grain boundary phase in a thickness direction with respect to a thickness T1 of the silicon nitride substrate is 0.01 to 0.30, and a variation from a dielectric strength mean value when measured by a four-terminal method in which electrodes are brought into contact with a front and a rear surfaces of the substrate is 20% or less. The dielectric strength mean value of the silicon nitride substrate can be 15 kV/mm or more. According to above structure, there can be obtained a silicon nitride substrate and a silicon nitride circuit board using the substrate in which variation in the dielectric strength is decreased.
申请公布号 US2016251223(A1) 申请公布日期 2016.09.01
申请号 US201415027829 申请日期 2014.10.21
申请人 KABUSHIKI KAISHA TOSHIBA ;TOSHIBA MATERIALS CO., LTD. 发明人 NAKAYAMA Noritaka;AOKI Katsuyuki;SANO Takashi
分类号 C01B21/068;H05K1/02;H01L23/373;H01L23/498;H05K1/03;H01L23/15 主分类号 C01B21/068
代理机构 代理人
主权项 1. A silicon nitride substrate comprising silicon nitride crystal grains and a grain boundary phase and having a thermal conductivity of 50 W/m·K or more, wherein, in a sectional structure of the silicon nitride substrate, a ratio (T2/T1) of a total length T2 of the grain boundary phase in a thickness direction with respect to a thickness T1 of the silicon nitride substrate is 0.01 to 0.30, and a variation from a dielectric strength mean value when measured by a four-terminal method in which electrodes are brought into contact with a front and a rear surfaces of the substrate is 20% or less.
地址 Tokyo JP