| 摘要 |
PURPOSE: An electronic device and a manufacturing method thereof are provided to reduce manufacturing costs using an external heat sink having a ground connection unit. CONSTITUTION: An electronic device comprises an IC(Integrated Circuit) package which is attached to a substrate, a heat sink(155), and films(160A,160B). The heat sink is attached to the IC package. The film has conductivity and touches the heat sink and the IC package. The film is extended to the substrate and provides a ground connection unit for the heat sink. The film comprises electro-conductive polymer. The heat sink is combined with a mold compound which encapsulates at least a part of the IC package. |
