| 摘要 |
A void behavior analysis method for analyzing, by means of a computer, the behavior of a void generated in the process of molding a liquid material injected into a space inside a mold comprises: an input step of inputting or generating a shape corresponding to a filling part of a product to be analyzed, a physical property value of a filling material, and an initial condition of a void particle, assuming the existence of a void; and a calculation step of calculating an amount of movement of the void particle at prescribed time intervalf, using data from the input step. In the calculation step, a determination is made as to whether the void particle is in contact with a wall surface, for each time step. If it is determined that the void particle is in contact with a wall surface, a resistance coefficient of the void is calculated as a function including the movement speed of the void, the diameter of the void, the viscosity of a resin material, and the angle of inclination of the wall surface. |
