发明名称 SILVER POWDER AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a silver powder capable of reducing volume resistivity of a conductive film manufactured by using a conductive paste and a manufacturing method of the silver powder capable of manufacturing such silver powder at low cost.SOLUTION: A cake (dry weight loss of 15% or less) obtained by filtering a silver-containing slurry obtained by adding a reductant to an aqueous reaction system containing a silver ion and reduction precipitating a silver particle, and water washing it is dehydrated at room temperature, ground at room temperature to prepare ground powder with dry weight of 1 to 6.5%, classified at room temperature to obtain a silver powder having crystalline diameter of 30.0 to 31.5 nm, moisture content of the silver powder by a Karl Fischer method of 5 to 40 ppm, dry weight loss of less than 0.01% and surface moisture content of 0.4 to 2.9 molecule/nm.SELECTED DRAWING: Figure 1
申请公布号 JP2016216824(A) 申请公布日期 2016.12.22
申请号 JP20160097022 申请日期 2016.05.13
申请人 DOWA ELECTRONICS MATERIALS CO LTD 发明人 NOGAMI TOKUAKI;HARIGAE HIKOICHI
分类号 B22F9/24;B22F1/00;H01B1/00;H01B1/22;H01B5/00;H01B13/00 主分类号 B22F9/24
代理机构 代理人
主权项
地址