BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

摘要

Some embodiments relate to a three-dimensional (3D) integrated circuit (IC). The 3DIC includes a first substrate including a photodetector which is configured to receive light in a first direction from a light source. An interconnect structure is disposed over the first substrate, and includes a plurality of metal layers and insulating layers that are over stacked over one another in alternating fashion. One of the plurality of metal layers is closest to the light source and another of the plurality of metal layers is furthest from the light source. A bond pad recess extends into the interconnect structure from an opening in a surface of the 3DIC which is nearest the light source and terminates at a bond pad. The bond pad is spaced apart from the surface of the 3DIC and is in direct contact with the one of the plurality of metal layers that is furthest from the light source.

主权项

1. An integrated circuit (IC), comprising:
a first substrate including a photodetector which is configured to receive light in a first direction from a light source; an interconnect structure over the first substrate, and including a plurality of metal layers and insulating layers that are over stacked over one another in alternating fashion, wherein one of the plurality of metal layers is closest to the light source and another of the plurality of metal layers is furthest from the light source; and a bond pad recess extending into the interconnect structure from an opening in a surface of the IC which is nearest the light source and terminating at a bond pad, wherein the bond pad is spaced apart from the surface of the IC and is in direct contact with the another of the plurality of metal layers that is furthest from the light source.