| 发明名称 |
METHODS INCLUDING A PROCESSING OF WAFERS AND SPIN COATING TOOL |
| 摘要 |
A method includes performing a spin coating process. In the spin coating process, a first fluid is dispensed to a surface of a wafer. The method further includes performing an inspection of an edge area of the wafer. On the basis of the inspection of the edge area of the wafer, a defect analysis is performed. In the defect analysis, it is determined if the edge area of the wafer has a defect that is indicative of an insufficient coating of the surface of the wafer by the first fluid. |
| 申请公布号 |
US2016379900(A1) |
申请公布日期 |
2016.12.29 |
| 申请号 |
US201514753198 |
申请日期 |
2015.06.29 |
| 申请人 |
GLOBALFOUNDRIES Inc. |
发明人 |
Maehr Torsten;Freitag Martin;Hotzel Arthur |
| 分类号 |
H01L21/66;C23C16/04;H01L21/67;H01L21/02;H01L21/687 |
主分类号 |
H01L21/66 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method, comprising:
performing a spin coating process, said spin coating process comprising dispensing a first fluid to a surface of a wafer; after performing said spin coating process, the method further comprising:
performing an inspection of an edge area of said wafer; andperforming a defect analysis on the basis of said inspection of said edge area of said wafer, said defect analysis comprising determining if said edge area of said wafer comprises a defect that is indicative of an insufficient coating of said surface of said wafer by said first fluid. |
| 地址 |
Grand Cayman KY |
