| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a self matching wafer, or a chip structure, including a substrate, at least one first recessed base part, at least one second recessed base part, at least one connection structure, and at least one bump. <P>SOLUTION: A substrate 100 includes a first surface 101a and a second surface 101b, and at least one pad 102 is formed on the first surface 101a. The first recessed base part 116 is arranged on the first surface 101a, being electrically connected to the pad 102. The second recessed base part 120 is arranged on the second surface 101b. The connection structure, for electrical connection of the first and second recessed base parts 116 and 120, penetrates the substrate 100, and is arranged between the first and second recessed base parts 116 and 120. A bump 122 is filled in the second recessed base part 120 and protrudes from the second surface 101b. <P>COPYRIGHT: (C)2009,JPO&INPIT |
