ELECTRICALLY CONDUCTIVE PASTE, CONNECTION STRUCTURE, AND PRODUCTION METHOD FOR CONNECTION STRUCTURE

摘要

Provided is an electrically conductive paste that makes it possible to efficiently arrange solder particles upon an electrode, that makes it possible to prevent positional displacement between electrodes, and that makes it possible to increase the reliability of conduction between electrodes. This electrically conductive paste includes: as a thermosetting component, a thermosetting compound and a heat-curing agent; and a plurality of solder particles. The ratio of the viscosity of the electrically conductive paste at 80°C below the melting point of the solder particles to the viscosity of the electrically conductive paste at 30°C below the melting point of the solder particles is 1.5-4.