| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition for sealing a semiconductor, capable of improving workability and reliability by imparting toughness to a cured material and controlling thixotropic development; and to provide a semiconductor apparatus using the same.SOLUTION: A liquid epoxy resin composition for sealing a semiconductor contains, as essential components: an epoxy resin; a curing agent of the following formula (I); and an inorganic filler. The liquid epoxy resin composition for sealing the semiconductor contains a diamine curing agent represented by the formula (I) (wherein, Rshows a hydrogen atom or an optionally substituted hydrocarbon group), and further contains an aminosilane compound. |
