发明名称 Method for manufacturing piezoelectric vibration device
摘要 A method for manufacturing a piezoelectric vibration device wherein a substrate is prepared, and a piezoelectric resonator element is mounted on the substrate. Before or after a packaging member is joined to the substrate, the piezoelectric resonator element is exposed to an environment at a higher temperature than ambient temperature and a higher humidity than ambient humidity, and then an electrical property is measured to detect attachment of dust and/or foreign matter according to a variation of the electrical property.
申请公布号 US9479135(B2) 申请公布日期 2016.10.25
申请号 US201213418669 申请日期 2012.03.13
申请人 MURATA MANUFACTURING CO., LTD. 发明人 Sato Takeo;Nagamine Yuichiro
分类号 H03H3/04;H03H9/10;C04B35/46;C04B35/48;H01L41/22;H01L41/25;H03H3/02;G01N29/02;G01N29/036;G01H3/00 主分类号 H03H3/04
代理机构 Arent Fox LLP 代理人 Arent Fox LLP
主权项 1. A method for manufacturing a piezoelectric vibration device, the method comprising: mounting a piezoelectric vibration element on a substrate; exposing the piezoelectric vibration element to a temperature higher than an ambient temperature and to a humidity higher than an ambient humidity; and detecting a variation of an electrical property caused by dust or contaminating foreign matter that is attached to the piezoelectric vibration element and that absorbs moisture while the piezoelectric vibration element is kept at the temperature higher than the ambient temperature and at the humidity higher than the ambient humidity.
地址 Nagaokakyo-Shi, Kyoto-Fu JP