发明名称 Rotary dispensing pump
摘要 A rotary pump that may be used in manual or automatic dispensing systems to dispense material such as epoxy or solder paste, and the like. The rotary pump has a feed screw shaft with fins disposed in a mixing chamber that mixes the epoxy or solder paste. Epoxy or solder paste disposed in a container is forced by air pressure from the container through a feed shaft to the mixing chamber. The feed screw shaft and fins are driven by a motor that rotates the shaft and fins to blend the epoxy or solder paste in the mixing chamber. The epoxy or solder paste is forced out of a dispensing tip onto an article by the rotary motion of the feed screw shaft. Therefore, mixing of the epoxy or solder paste is achieved just prior to the point of application. The rotary pump keeps the epoxy or solder paste thoroughly blended before it is dispensed.
申请公布号 US5984147(A) 申请公布日期 1999.11.16
申请号 US19970954657 申请日期 1997.10.20
申请人 RAYTHEON COMPANY 发明人 VAN NGO, HOANG
分类号 B23K3/06;F04D3/02;F04D7/04;G01F11/20;G01F13/00;(IPC1-7):G01F11/20 主分类号 B23K3/06
代理机构 代理人
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