发明名称 EPOXY-BASED RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a composition which shows enhanced humidity resistance, fluidity, hardness under a hot condition and adhesion to a silver-plated item by making the composition contain an epoxy resin, a hardening agent, a filler and a silane coupling agent which contains a silane compound having an amino group and a silane compound having a specific structure, the content of each silane compound being specific. SOLUTION: A composition contains 5 to 25 wt.% of an epoxy resin (A) such as bisphenol A type epoxy resin or the like, a hardening agent (B) such as novolak resin or the like, the equivalent ratio of the component B to the component A being 0.5 to 1.6, 85 to 95 wt.% of a filler agent such as fused silica and a silane coupling agent (D), the amount of the component D being 0.1 to 5 pts.wt. per 100 pts.wt. of the component C. The component D contains a silane compound containing a secondary amino group represented by formula I or II and a silane compound represented by formula III, the weight ratio being 85/15 to 50/50 (wherein R1 to R3 are each a 1 to 30C monovalent hydrocarbon group; R4 to R5 are each a 1 to 20C divalent 1-2 hydrocarbon group; and n is an integer of 1 to 3).
申请公布号 JP2000336250(A) 申请公布日期 2000.12.05
申请号 JP19990149186 申请日期 1999.05.28
申请人 TORAY IND INC 发明人 SHIMIZU MICHIO;NIWA KATSUHIRO;TANAKA MASAYUKI
分类号 C08L63/00;C08G59/62;C08K3/00;C08K5/5455;H01L23/29;H01L23/31;(IPC1-7):C08L63/00;C08K5/545 主分类号 C08L63/00
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