| 摘要 |
A polishing pad for planarizing and polishing a semiconductor substrate. The polishing pad (22) includes an adhesive layer (34) that is operative to adhere the polishing pad to a polishing fixture. To protect the adhesive layer from contamination during storage and shipment, a release liner (24) is placed over the adhesive layer. The release liner has sufficient surface characteristics to stay in adhesive connection with the adhesive layer during storage and shipment; however, the release liner is operative to be peeled away from the adhesive layer without disturbing the bond between the polishing pad and the adhesive layer. To aid in the removal of the release liner from the polishing pad, the release liner includes a pull tab (26). The pull tab is comprised of a single-sided tape that is adhered to the outer surface of the release liner. A portion (28) of the pull tab extends beyond the edge of the release liner. This extending portion has sufficient length to enable an operator of the polishing fixture to remove the release liner from the polishing pad while wearing gloves.
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