发明名称 Side stacking apparatus and method
摘要 A module has at least two ICs connected to each other such that they lie in different planes and are arranged as a first stack of ICs, a third IC is connected to at least one of the at least two ICs, wherein the third IC is off plane from both of the at least two ICs.
申请公布号 US8084851(B2) 申请公布日期 2011.12.27
申请号 US20100710811 申请日期 2010.02.23
申请人 TREZZA JOHN;CUFER ASSET LTD. L.L.C. 发明人 TREZZA JOHN
分类号 H01L23/52 主分类号 H01L23/52
代理机构 代理人
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