PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND ELECTRONIC PARTS USING THE PHOTOSENSITIVE RESIN COMPOSITION

摘要

A photosensitive resin composition includes (a) a polymer mainly composed of a repeating unit represented by the following general formula (I); (b) a dissolution accelerator for a developing solution; and (c) a solvent: wherein R¹ is a trivalent or tetravalent organic group, R² is a bivalent organic group, R is a monovalent organic group having a carbon-carbon unsaturated double bond or a group represented by O^-M⁺ (M⁺ represents a hydrogen ion or a cation composed of hydrogen and a compound having the carbon-carbon unsaturated double bond) in which the compound having the carbon-carbon unsaturated double bond is ionically bonded, at least one carbon-carbon unsaturated double bond is contained in all repeating units, m is an integer of 2 or more, and n is 1 or 2.