发明名称 THIN-FILM SEMICONDUCTOR DEVICE, AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method of crystallizing a semiconductor thin film formed on an insulating substrate with laser irradiation, which can suitably remove a cap insulating film formed on the semiconductor film. SOLUTION: The method of forming a thin-film transistor includes steps of forming a film structure including a base insulating film, a semiconductor film, and a cap insulating film, sequentially on an insulating substrate; crystallizing the semiconductor film by irradiating the film structure with laser light having a predetermined light intensity distribution; etching and removing a cap insulating film around a channel formation region so as to leave the cap insulating film on the channel formation region in the thin-film transistor; depositing a metallic film on the entire etched substrate; subjecting the resultant structure to heat treatment to cause a reaction of the region with the cap insulating film removed therefrom with the metallic film and to form a metal silicide layer; removing the unreacted metallic film on the cap insulating film; and removing the cap insulating film on the channel formation region. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007220948(A) 申请公布日期 2007.08.30
申请号 JP20060040687 申请日期 2006.02.17
申请人 ADVANCED LCD TECHNOLOGIES DEVELOPMENT CENTER CO LTD 发明人 KAWACHI GENSHIRO
分类号 H01L29/786;G02F1/1368;H01L21/20;H01L21/336 主分类号 H01L29/786
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