| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain uniform illumination by achieving a wide range of light distribution using a circuit board in a projecting shape and restraining variations in element characteristics by uniformly radiating heat generated from each LED element to be packaged. <P>SOLUTION: A heat radiation means, such as a metal block 21, is provided inside the projecting circuit board 11 where a plurality of LED elements 12 are packaged on a projecting surface 11a; and the shape of a part close to the projecting surface 11a in the projecting circuit board 11 of the heat radiation means follows that of the projecting surface 11a. <P>COPYRIGHT: (C)2008,JPO&INPIT |
