SOLDER ALLOY, SOLDER PASTE AND ELECTRONIC CIRCUIT BOARD

摘要

This solder alloy is substantially formed of tin, silver, copper, bismuth, antimony and cobalt. The content ratio of silver relative to the total amount of the solder alloy is from 2% by mass to 4% by mass (inclusive). The content ratio of copper is from 0.3% by mass to 1% by mass (inclusive). The content ratio of bismuth is more than 4.8% by mass but 10% by mass or less. The content ratio of antimony is from 3% by mass to 10% by mass (inclusive). The content ratio of cobalt is from 0.001% by mass to 0.3% by mass (inclusive). The content ratio of tin is the balance.