POLISHING COMPOSITION CONTAINING CERIA PARTICLES AND METHOD OF USE

摘要

The invention provides a chemical-mechanical polishing composition including wet-process ceria particles having a median particle size of about 25 nm to about 150 nm and a particle size distribution of about 300 nm or more, and an aqueous carrier. The invention also provides a method of polishing a substrate, especially a substrate comprising a silicon layer, with the polishing composition.

主权项

1. A chemical-mechanical polishing composition comprising:
(a) wet-process ceria particles having a median particle size of about 25 nm to about 150 nm and a particle size distribution of about 300 nm or more, wherein the wet-process ceria particles have a surface that comprises tridentate hydroxyl groups and has a surface coverage of tridentate hydroxyl groups that is about 2.0×10−5 moles/m2 or more, and (b) an aqueous carrier.