| 发明名称 |
APPARATUS AND METHOD FOR CHUCKING WARPED WAFERS |
| 摘要 |
An apparatus tor fixing a wafer, including a chuck having a surface, a plurality of through bores in the chuck extending through the surface of the chuck, a fixed vacuum bellows, and a plurality of floating air bearings, wherein the fixed vacuum bellows and a respective floating air bearing of the plurality of floating air bearings are each individually arranged in separate through bores of the plurality of through bores and elevationally above the surface of the chuck. |
| 申请公布号 |
US2016268156(A1) |
申请公布日期 |
2016.09.15 |
| 申请号 |
US201615065430 |
申请日期 |
2016.03.09 |
| 申请人 |
KLA-TENCOR CORPORATION |
发明人 |
Subrahmanyan Pradeep;HUANG Luping;POHLHAMMER Chris |
| 分类号 |
H01L21/683 |
主分类号 |
H01L21/683 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus for fixing a wafer, comprising:
a chuck comprising a surface; a plurality of through bores in the chuck extending through the surface of the chuck; a fixed vacuum bellows; and, a plurality of floating air bearings, wherein the fixed vacuum bellows and a respective floating air bearing of the plurality of floating air bearings are each individually arranged in separate through bores of the plurality of through bores and elevationally above the surface of the chuck. |
| 地址 |
Milpitas CA US |
