| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a separation positioning type wire bonding structure and a method for preventing a displacement of lead pins capable of improving manufacturing efficiency and reducing manufacturing cost. <P>SOLUTION: In the separation positioning type wire bonding structure, a plurality of bonding pads 3 are provided on a circuit board 5. The bonding pads 3 join an electronic component 1 with a surface mounting technology having a plurality of lead pins 11, are larger than the lead pins 11, and are located in an arrangement direction 4 of the circuit board 5. At least two bonding pads 3 are provided with at least two separations 31, respectively located at parts corresponding to outer areas of the lead pins 11 so as to position peripheral edges of the lead pins 11 and prevent the displacement. <P>COPYRIGHT: (C)2012,JPO&INPIT |
