Stacked structure for an image sensor has substrates forming an enclosed space in which sensor is located

摘要

The image sensor has a substrate (10) with a top surface (12) on which there are signal connections (16). The underside has connections to a circuit board (22). Other layers (12,30) support the image sensing chip (26) within a closed space that has a transparent cover layer (32). The unit is mounted on a carrier (18) .