ENHANCED CONNECTION ARRANGEMENT FOR CO-PLANAR VERTICAL SURFACE MOUNTING OF SUBASSEMBLIES ON A MOTHER BOARD

摘要

The invention provides a subassembly 13 to facilitate co-planar vertical surface mounting of subassembly boards 14. By "vertically mounting" is meant that a subassembly circuit board 14 with a major surface is mounted perpendicular to the major surface of a circuit motherboard 11. In accordance with the invention, a subassembly 13 for co-planar vertical surface mounting comprises a subassembly board 14 coupled between a pair of base headers 18A, 18B. Advantageously one base header 18A comprises a plurality of mounting lugs 180 secured to a longitudinal element 182A in a co-planar configuration. The other base header 18B conveniently comprises a plurality of connector pins 183 secured to an elongated header element 182B in co-planar configuration. The two headers 18A, 18B interlock with the board 14 to provide connection and co-planar support. Edge metallization of the subassembly board 14 can provide enhanced thermal or electrical connection to the underlying portions of one or more lugs 180.