发明名称 Sawing device for e.g. quartz electronic component, has wires moving alternately or continuously to press against fixed saw piece, maintaining device arranged such that sawing gap width is kept constant during sawing of chips
摘要 <p>The device has a wire strand maintained in position by a groove provided on a surface of cylindrical guides. Wires move alternately or continuously to press against a fixed saw piece (17) on a support table (18). A maintaining device (22) maintains partially or fully sawed chips (23) in parallel. The device is arranged such that widths of sawing gaps (24) are kept approximately constant during sawing of chips by wire.</p>
申请公布号 CH696159(A5) 申请公布日期 2007.01.31
申请号 CH20030000043 申请日期 2003.01.13
申请人 HCT SHAPING SYSTEMS S.A. 发明人 MULLER ANDREAS;BORTNIKOV ALEXANDER
分类号 B23D57/00;B23D5/04 主分类号 B23D57/00
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