| 摘要 |
<P>PROBLEM TO BE SOLVED: To heighten the effect of dissipating heat from a heat generating part in an electronic device to its metal case, and suppress labor and costs of designing and packaging the electronic device. <P>SOLUTION: A heat dissipation material 108 is, e.g., a rubber-made member formed of silicone resin or acrylate resin into a rectangular solid, and is disposed onto a substrate 101 such that an electrode part of a heat generating part 106a (part to which an electrode 109a is soft-soldered) and a metal case 103 are thermally connected. Concretely speaking, the heat dissipation material 108 is disposed to the substrate 101 such that one of its side surfaces is brought into contact with the electrode part of the heat generating part 106a while its top surface is brought into contact with an insulating plate 102. Then, heat generated from the electrode part of the heat generating part 106a is conducted to the metal case 103 through the contact surface with its electrode part to the contact surface with the insulating plate 102. <P>COPYRIGHT: (C)2008,JPO&INPIT |
