| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mechanical quantity detection sensor capable of preventing joining between a weight portion and a glass substrate, on the occasion of anodic bonding between the glass substrate and a transducer structure composed of a semiconductor. <P>SOLUTION: The mechanical quantity detection sensor is equipped with a first structure having a fixed part, a displacement section, and a connection section, a second structure having a weight section to be joined to the displacement section, and a seating to be arranged surrounding the weight section and joined to the fixed part, a joining body which is made up of insulating material and joins the first structure and the second structure, a substrate arranged by overlying the second structure, made up of insulating material, and having a conductive member arranged on a counter surface to the weight section, a first conductive section for electrically connecting the fixed part and the seating, and a second conductive section for electrically connecting the displacement section and the weight section. The substrate has a conductive section for electrically connecting the conductive member and the seating, when at least the substrate and the second structure are joined. <P>COPYRIGHT: (C)2008,JPO&INPIT |
