| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate holding device capable of adjusting a polishing profile of an edge part of a substrate.SOLUTION: A substrate holding device includes: an inner retaining ring 20 vertically movable independently of a top ring body 10 and arranged so as to surround a substrate W; an inner pressing mechanism 60 for pressing the inner retaining ring 20 against the polishing surface of a polishing pad; an outer retaining ring 30 vertically movable independently of the inner retaining ring 20 and the top ring body 10; an outer pressing mechanism 80 for pressing the outer retaining ring 30 against the polishing surface; and a support mechanism 111 for receiving lateral force applied to the inner retaining ring 20 from the substrate W during polishing of the substrate W and for tiltably supporting the outer retaining ring 30. |
